Product model: SPI-6500
Application range: Solder paste. Red glue. BGA.FPC.CSP
Measurement item: Thickness; area; volume;.3D shape; plane distance
measuring principle: Automatic measurement and display of PCB deformation
or tilt angle by laser trigonometric function method
Software language:Chinese / English
Lighting source: White highlights LED
1 . friendly programming interface
2. a variety of measurement methods
3 .adjustable scanning interval
4. the image of the 3D simulation function
5. independent 3D Dynamic Observer
6. powerful SPC function
7. one back to the screen center function
8. It can measure the thickness of screen printing and copper
1. the use of imported German high-definition color camera, to ensure high accuracy and high stability test.
2. the use of micro power level two laser, the light interference by the outside environment, smaller, more stable, longer life.
3. flexible hardware design, light source, laser and camera can be used to test PCB boards of different colors.
4. software analysis conditions based on the database, according to the analysis of the conditions to achieve early warning function, intuitive and understandable.
5. powerful report analysis function, automatic generation of R-Chart, X-Bar, automatic calculation CPK.
6. export detailed and complete SPC reports, completely avoid the drawbacks of handwritten reports.
7. the software uses simple and practical concept, focusing on high-precision design of the test, the correction block repeat accuracy of plus or minus 0.001mm.
Product model: SPI-6500
Application range: Solder paste. Red glue. BGA.FPC.CSP
Measurement item: Thickness; area; volume;.3D shape; plane distance
measuring principle: Automatic measurement and display of PCB deformation
or tilt angle by laser trigonometric function method
Software language:Chinese / English
Lighting source: White highlights LED
Measurement mode: Automatic full screen measurement. Box selection,
automatic measurement. Frame selection, manual measurement
Range of vision:12mm*15mmn
Camera pixel:3 million / field
Maximum resolution:0.1umn
Scanning interval:5 um /10 um /15 um /20 um
Repeated measurement accuracy :Height<±1um,area<1%,volume<1%n magnification 50X
Maximum measurable height:5mm
Maximum measurement speed: 250Profiles/s
3D mode: Surface. Line. Point 3 different 3D simulation chart, zoom. Rotate
SPC software: Production data, printed data, solder paste data, steel mesh data,
and measurement results are independently analyzed X-Bar&R chart analysis,
histogram analysis, &Ca/Cp/Cpk output, Sigma automatic judgment.
operating system: Windows7
Power supply: 220V 50/60Hz
Maximum power: 300W
Weight: 35KG
Size: L*W*H (400, mm, *550, mm, *360, mm)
